{"id":29647,"date":"2025-05-16T15:29:00","date_gmt":"2025-05-16T07:29:00","guid":{"rendered":"\/phys\/?post_type=tkumembers&#038;p=29647"},"modified":"2025-05-22T15:44:28","modified_gmt":"2025-05-22T07:44:28","slug":"assoc-prof-how-wen-jou","status":"publish","type":"tkumembers","link":"\/phys\/?tkumembers=assoc-prof-how-wen-jou","title":{"rendered":"Assoc. Prof. How-Wen Jou"},"content":{"rendered":"\n<div class=\"wp-block-tkuwpbs5-bs5-container container\" style=\"position:relative\" block_id=\"lvp2sg8rxb208n4hmcl\"><style><\/style>\n<div class=\"wp-block-tkuwpbs5-bs5-row row\">\n<div class=\"wp-block-tkuwpbs5-bs5-column col-md-4 align-self-start\"><img decoding=\"async\" src=\"\/phys\/wp-content\/uploads\/2024\/05\/\u517c15.\u5468\u539a\u6587-scaled-e1716431289288.jpg\" class=\"img-fluid img-fluid mx-auto d-block\" alt=\"\u4e0a\u50b3\u5716\u7247\">\n\n\n<div style=\"height:5vh\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-tkuwpbs5-bs5-column col-md-8 align-self-start\">\n\n\n<p class=\"has-medium-font-size\"><strong>Position:<\/strong>Associate Professor<\/p>\n\n\n\n<p class=\"has-medium-font-size\"><strong>Email: <\/strong>\u00a0<a href=\"mailto:anetwork323@gmail.com\">anetwork323@gmail.com<\/a><\/p>\n\n\n\n<p class=\"has-medium-font-size\"><strong>Research Expertise:<\/strong> Integrated Circuit Design, Semiconductor Manufacturing Process, Software Simulation, High-Tech Patent Intellectual Property, High-Tech Popular Science<\/p>\n\n\n\n<p class=\"has-medium-font-size\"><strong>Education:<\/strong> Ph.D. in Electrical Engineering, University at Buffalo, State University of New York<\/p>\n\n\n\n<p><br><\/p>\n<\/div>\n<\/div>\n<\/div>\n","protected":false},"author":12,"template":"wp-custom-template-detail-4-page-en","meta":{"_uag_custom_page_level_css":""},"categories":[129],"tags":[],"acf":[],"featured_image_urls":{"full":"","thumbnail":"","medium":"","medium_large":"","large":"","twp-icon":"","1536x1536":"","2048x2048":""},"post_excerpt_stackable":"<p>Position:Associate Professor Email: \u00a0anetwork323@gmail.com Research Expertise: Integrated Circuit Design, Semiconductor Manufacturing Process, Software Simulation, High-Tech Patent Intellectual Property, High-Tech Popular Science Education: Ph.D. in Electrical Engineering, University at Buffalo, State University of New York<\/p>\n","category_list":"<a href=\"\/phys\/?cat=129\" rel=\"category\">en_menber<\/a>","author_info":{"name":"\u674e\u7b60\u92a3","url":"\/phys\/?author=12"},"comments_num":"0 comments","uagb_featured_image_src":[],"uagb_author_info":{"display_name":"\u674e\u7b60\u92a3","author_link":"\/phys\/?author=12"},"uagb_comment_info":0,"uagb_excerpt":null,"_links":{"self":[{"href":"\/phys\/index.php?rest_route=\/wp\/v2\/tkumembers\/29647"}],"collection":[{"href":"\/phys\/index.php?rest_route=\/wp\/v2\/tkumembers"}],"about":[{"href":"\/phys\/index.php?rest_route=\/wp\/v2\/types\/tkumembers"}],"author":[{"embeddable":true,"href":"\/phys\/index.php?rest_route=\/wp\/v2\/users\/12"}],"wp:attachment":[{"href":"\/phys\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=29647"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"\/phys\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=29647"},{"taxonomy":"post_tag","embeddable":true,"href":"\/phys\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=29647"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}